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Glossary

ABF substrate

ABF (Ajinomoto Build-up Film) substrates are the fine-pitch packaging layer that routes the thousands of connections between a high-end processor and the main board. They are hard to make, capacity is concentrated in a few Asian suppliers, and lead times have stretched to around a year, making substrates one of the tightest physical constraints on shipping AI servers, regardless of how many chips are available.

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