bonding

For HBM, which stacks many DRAM layers, the precision of this step is effectively the yield. Each added layer makes joining harder, turning back-end processing into the bottleneck.

Predictions & track record (1)

• Awaiting grading The US government just took 1% of GlobalFoundries, and the money it handed over was for research, not a fabScore on whether the letter of intent converts into a signed deal with the 300 million dollars disbursed, and whether the other six close on the same equity terms.

3 related posts

• Watch The US government just took 1% of GlobalFoundries, and the money it handed over was for research, not a fab Serenity (@aleabitoreddit) · 2026-07-29
• Watch Samsung and SK hynix's 3D IC Caution Is Really About HBM Eating All Their Bandwidth Jukan (@jukan05) · 2026-07-25
• Bull Samsung starts building a hybrid-bonding line for next-gen HBM, picks Dutch supplier Besi Jukan (@jukan05) · 2026-07-21