TSV

Through-silicon via: a vertical electrical connection drilled through a chip die, the wiring technique that lets memory dies stack.

Predictions & track record (1)

• Awaiting grading The long-term contracts said to cap SK hynix's upside turn out to carry no price ceiling at allCheck at the third-quarter results whether SK hynix's DRAM average selling price growth comes close to the conventional DRAM spot move over the same period. Close means the contracts locked volume only, well short means July's price-lock reading was right.

1 related posts

• Watch The long-term contracts said to cap SK hynix's upside turn out to carry no price ceiling at all Jukan (@jukan05) · 2026-07-29